IC Substrate, also known as Integrated Circuit Substrate, is the core component of chip packaging, located between the bare chip (Bare Die) and the main PCB (Motherboard).
Physical support and protection:
Fix the chip to prevent damage during transportation and assembly.
Buffer the thermal expansion coefficient difference between the chip and the PCB to reduce mechanical stress.
Form part of the packaging shell to isolate external interference (such as moisture, dust).
Electrical interconnection:
Through internal fine wiring, redistribute the tiny electrode pads (with spacing possibly as low as several tens of micrometers) on the chip into larger solder ball arrays (such as BGA, LGA), adapting to the soldering requirements of the main PCB.
Provide a high-speed signal transmission path to ensure signal integrity (such as 5G communication modules).
Heat management:
Part of the design conveys the chip's heat to the outside through heat dissipation pads or heat-conductive holes, enhancing reliability (such as high-power processors).
High Frequency PCBs are specialized printed circuit boards designed to handle and transmit high-frequency signals, typically operating above 1 GHz, with some applications extending into the millimeter-wave band (30 GHz and beyond). These boards are engineered to maintain signal integrity and reliability during high-speed data transmission, making them indispensable in modern high-speed communication and electronic syste
High Frequency PCBs are specialized printed circuit boards designed to handle and transmit high-frequency signals, typically operating above 1 GHz, with some applications extending into the millimeter-wave band (30 GHz and beyond). These boards are engineered to maintain signal integrity and reliability during high-speed data transmission, making them indispensable in modern high-speed communication and electronic systems.
Product name: High frequency PCB
Material: Roger RO4350B + Shengyi S1000 FR4
Layers: 4layers
Copper: 1oz
Thickness: 1.20mm
Surface finishing: Immersion Gold 2U"
Soldermask: Taiyo Green soldermask
Application: communication device
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Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).