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PCB Manufacturing Process

PCB Manufacturing Process

✔ Up to 60 Layers

✔ ±5% Impedance Control

✔ MAX size: 1560x600mm

✔ Min trace, 2mil

✔ Min Core 0.025mm, copper 5um

✔ tolerence controlled

✔ No MOQ, 1pcs acceptable

✔ 48 hours Quick Turn service


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Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).

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