Powering the Space Data Revolution
From Earth to Orbit — Built on Kartain's Advanced Substrates
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From Earth to Orbit — Built on Kartain's Advanced Substrates
Get Free Quote NowKartain Technology Co., Ltd. is a leading global manufacturer of high-complexity printed circuit boards and advanced packaging substrates from 2010. We specialize in high-layer-count PCBs (up to 60 layers), rigid-flex PCB boards, ceramic circuits, glass-based substrates, and IC substrates for aerospace, defense, 5G infrastructure, AI accelerators, and high-performance computing.
All Products
✔ Up to 60 Layers
✔ ±5% Impedance Control
✔ MAX size: 1560x600mm
✔ Min trace, 2mil
✔ Min Core 0.025mm, copper 5um
✔ tolerence controlled
✔ No MOQ, 1pcs acceptable
✔ 48 hours Quick Turn service
SIP Design & Process Capabilities,Wafer thinning,scribing capability, Die stack & Bonding
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WLP Key Technology: Redistribution Layers(RDL):5um line width RDL can achieve high yield currently……
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What's New at substrate manufacturing Technologies
Organic interposers are gaining traction as a cost-effective alternative to silicon. But t...
While lead times for ABF substrates stretch to 20+ weeks, agile innovators are turning to ...
Despite increased capacity, the global IC substrate shortage—especially for FCBGA and SiP ...
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Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).
