Jan 15,2026
With HBM3 stacking 12+ dies, the substrate must handle extreme thermal cycling and 40μm bump pitch. Only advanced mSAP can deliver...
Kartain supports HBM-compatible substrates with 15μm lines and via-in-pad technology.
Sustainable Electronics: Can High-End PCBs Be Eco-Friendly?
Jan 15,2026
Server Motherboards Now Require 20+ Layers of High-Speed HDI
Jan 15,2026
AR/VR Headsets Use Flex-Rigid HDI – But Yield Is a Nightmare
Jan 15,2026
EV Battery Management Systems Need Isolation-Grade HDI PCBs
Jan 15,2026
Quantum Computing Hardware Demands Cryogenic-Compatible PCBs
Jan 15,2026Reach out to us via chat, phone, or our simple contact form.
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Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).