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Flexible board

Flexible Printed Circuit Board (FPC) is a type of circuit board that uses flexible substrates (such as polyimide, polyester film, etc.) as its core. It is manufactured through printing technology to create conductive circuits and can integrate electronic components.

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Description

Flexible substrate: Typically made of polyimide (PI) or polyester (PET) films, it possesses high flexibility, high temperature resistance (PI can withstand 400°C), and chemical resistance.


Conductive layer: Mainly composed of copper foil, fabricated through electro-deposition (ED) or lamination processes, with adjustable thickness (e.g., 1/2oz, 1oz), supporting single-sided, double-sided or multi-layer circuit designs.


Cover layer: Composed of protective insulating materials (such as polyimide or acrylic), covering the conductive lines to prevent short circuits and mechanical damage.

Reinforcement plate: Optional rigid materials (such as FR4 or steel sheets) can be selected to enhance local mechanical strength, facilitating component soldering and installation.


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