KartaInTech provides high-precision Chip-on-Film (COF) substrate solutions with 8µm/8µm fine-line capability, engineered for space-constrained, high-density applications such as OLED display drivers, smartphone camera modules, and wearable electronics. Built on flexible polyimide film with optimized copper thickness and surface finish, our COF substrates support reliable thermocompression bonding, excellent bendability, and high-yield roll-to-roll manufacturing—delivering the right balance of performance, flexibility, and cost for mid-to-high-end consumer electronics.
High-Density Flexible Interconnect for Compact Electronics
At KartaInTech, we specialize in precision COF (Chip-on-Film) substrates with 8µm line / 8µm space fine-pitch capability—enabling compact, reliable, and high-performance interconnects for today’s most demanding consumer electronics. Our COF platforms are engineered for applications where space, flexibility, and signal integrity matter most.
Chip-on-Film (COF) is a flexible packaging technology where a bare semiconductor die is directly mounted onto a patterned polyimide (PI) film carrier using thermocompression bonding. The resulting ultra-thin, bendable module is widely used in:
OLED/LCD display driver ICs
Smartphone front/rear camera modules
Foldable phones and wearable devices
Medical imaging sensors and AR/VR optics
Unlike rigid PCBs or traditional TCP (Tape Carrier Package), COF offers superior bendability, thin profile (<30µm total thickness), and high I/O density—making it ideal for modern slim-form devices.
| Parameter | Specification |
|---|---|
| Minimum Line/Space | 8µm / 8µm |
| Base Material | Polyimide (PI) film, 12.5µm or 25µm thickness |
| Copper Thickness | 3µm – 5µm (electrodeposited) |
| Number of Layers | Single-layer (standard); dual-layer available on request |
| Surface Finish | OSP (Organic Solderability Preservative) or bare Cu (for ACF bonding) |
| Pitch Support | Down to 16µm pad pitch |
| Total Thickness (Typical) | 25–35µm (including coverlay) |
| Coverlay / PSR | Photoimageable cover layer or yellow PI coverlay |
| Reel Format | Compatible with standard 13" or 7" reels for pick-and-place |
High Frequency PCBs are specialized printed circuit boards designed to handle and transmit high-frequency signals, typically operating above 1 GHz, with some applications extending into the millimeter-wave band (30 GHz and beyond). These boards are engineered to maintain signal integrity and reliability during high-speed data transmission, making them indispensable in modern high-speed communication and electronic syste
High Frequency PCBs are specialized printed circuit boards designed to handle and transmit high-frequency signals, typically operating above 1 GHz, with some applications extending into the millimeter-wave band (30 GHz and beyond). These boards are engineered to maintain signal integrity and reliability during high-speed data transmission, making them indispensable in modern high-speed communication and electronic systems.
Product name: High frequency PCB
Material: Roger RO4350B + Shengyi S1000 FR4
Layers: 4layers
Copper: 1oz
Thickness: 1.20mm
Surface finishing: Immersion Gold 2U"
Soldermask: Taiyo Green soldermask
Application: communication device
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Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).