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  • COF multilayer FPC board

COF multilayer FPC board

Chip-on-FPC technology, where the driving IC is directly bonded to the flexible circuit board, enabling ultra-narrow bezel display.

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Description

Feature:

Ultra-thin (≤0.1mm), saves space and enhances screen ratio;

High-density wiring, supports FHD/4K resolution display;

High-temperature bonding process, with superior reliability compared to traditional COG solution.


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