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Advanced HDI PCB Demand Soars as AI and 5G Drive Miniaturization

Jan 15,2026

The race to pack more computing power into smaller devices is fueling unprecedented demand for advanced HDI PCBs with line/space below 30μm. With AI accelerators and 5G smartphones requiring ultra-dense interconnects, manufacturers face yield and material challenges...

 

Kartain Technology delivers high-yield HDI solutions down to 15/15μm using certified Panasonic and Mitsubishi materials, supporting rapid prototyping and volume production for global tech leaders.


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Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).

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