The 6-layer FPC is a flexible circuit board constructed by alternating six layers of conductive copper layers with flexible dielectric materials (such as polyimide). Its core advantages lie in high-density wiring, lightweight design, and excellent bending performance. It is widely used in fields with strict requirements for space, weight, and reliability, such as smart phones, wearable devices, medical electronics, and aerospace.
Six-layer conductive layer
The 6-layer FPC achieves complex circuit design through the stacking of six layers of copper foil. The thickness of each layer of copper foil can be selected according to requirements (such as 0.5 OZ to 6 OZ) to balance conductive performance and flexibility. The conductive layers are isolated by flexible insulating materials such as polyimide to ensure electrical isolation and mechanical flexibility.
Special process design
Blind holes and loose leaf design: Some 6-layer FPCs adopt blind hole technology between layers (such as between the 2nd and 3rd layers, and the 4th and 5th layers), achieving inter-layer electrical connection, and at the same time, through the loose leaf structure, enhancing the inter-layer bonding force and improving signal transmission stability.
Reinforcement plate application: To enhance local rigidity, 6-layer FPCs often add 0.48mm thick FR4 reinforcement plates in key areas (such as connector locations) to prevent copper foil from breaking due to repeated bending.
High Frequency PCBs are specialized printed circuit boards designed to handle and transmit high-frequency signals, typically operating above 1 GHz, with some applications extending into the millimeter-wave band (30 GHz and beyond). These boards are engineered to maintain signal integrity and reliability during high-speed data transmission, making them indispensable in modern high-speed communication and electronic syste
High Frequency PCBs are specialized printed circuit boards designed to handle and transmit high-frequency signals, typically operating above 1 GHz, with some applications extending into the millimeter-wave band (30 GHz and beyond). These boards are engineered to maintain signal integrity and reliability during high-speed data transmission, making them indispensable in modern high-speed communication and electronic systems.
Product name: High frequency PCB
Material: Roger RO4350B + Shengyi S1000 FR4
Layers: 4layers
Copper: 1oz
Thickness: 1.20mm
Surface finishing: Immersion Gold 2U"
Soldermask: Taiyo Green soldermask
Application: communication device
Reach out to us via chat, phone, or our simple contact form.
Get a FREE Quote Today
Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).