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4layer blind buried vias FR4 pcb boards

This is a 4-layer circuit board based on FR4 rigid substrate, which achieves high-density interconnection through the blind hole/mounted hole technology.

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Description

Feature:

Blind holes (connecting the surface layer and the inner layer), and buried holes (connecting the inner layers) enhance the wiring efficiency;

The cost is lower than that of HDI boards, suitable for medium-complexity circuits (such as industrial control and communication modules);

It has high mechanical strength, is resistant to vibration, and is suitable for traditional electronic devices. 


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