The double-layer flexible circuit board (2-Layer FPC) is composed of two layers of conductive copper foil and a flexible substrate (such as polyimide or polyester film).
Top Cover Layer (Coverlay): Protects the top copper foil circuit to prevent short circuits and mechanical damage.
Top Copper Foil: Etched to form conductive lines, supporting complex circuit designs.
Flexible Substrate (Substrate): The core supporting layer, providing flexibility and heat resistance (for example, polyimide can withstand a temperature of 400°C).
Bottom Copper Foil: Connected to the top copper foil through metallized vias to form a three-dimensional conductive path.
Bottom Cover Layer: Protects the bottom copper foil circuit to enhance bend resistance.
Key Characteristics:
Via connection: Metalized vias are formed through laser drilling or mechanical drilling to achieve electrical interconnection between two layers of copper foil, enhancing circuit density.
High flexibility: The substrate thickness can be as low as 0.1mm, supporting dynamic bending (such as the hinge area of foldable phone screens) or static bending (such as the strap of wearable devices).
Lightweight: The weight is reduced by over 70% compared to rigid circuit boards, significantly reducing the volume and weight of the end product.
High Frequency PCBs are specialized printed circuit boards designed to handle and transmit high-frequency signals, typically operating above 1 GHz, with some applications extending into the millimeter-wave band (30 GHz and beyond). These boards are engineered to maintain signal integrity and reliability during high-speed data transmission, making them indispensable in modern high-speed communication and electronic syste
High Frequency PCBs are specialized printed circuit boards designed to handle and transmit high-frequency signals, typically operating above 1 GHz, with some applications extending into the millimeter-wave band (30 GHz and beyond). These boards are engineered to maintain signal integrity and reliability during high-speed data transmission, making them indispensable in modern high-speed communication and electronic systems.
Product name: High frequency PCB
Material: Roger RO4350B + Shengyi S1000 FR4
Layers: 4layers
Copper: 1oz
Thickness: 1.20mm
Surface finishing: Immersion Gold 2U"
Soldermask: Taiyo Green soldermask
Application: communication device
Reach out to us via chat, phone, or our simple contact form.
Get a FREE Quote Today
Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).